By Joe Kelly
That includes worthwhile enter from industry-leading businesses and highly-regarded specialists within the box, this first-of-its style source deals skilled engineers a accomplished figuring out of the complicated subject matters in RF, SiP (system-in-package), and SoC (system-on-a-chip) construction checking out which are severe to their paintings related to semiconductor units. The ebook covers key dimension thoughts for semiconductor equipment checking out and assists engineers in explaining those ideas to administration to assist reduce undertaking fee, time, and assets. in accordance with real-world adventure and full of time-saving equations, this in-depth quantity bargains pros functional details on crucial issues that experience by no means been provided in one reference earlier than.
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Additional resources for Advanced Production Testing of RF, SoC, and SiP Devices
Devices because of their architecture. The superheterodyne architecture (see Chapter 1) that has been used from the beginning of wireless communications devices converts the frequencies that are input to lower frequencies, but far from dc, thereby never having to worry about the second-order product interference. More recently, the homodyne, or ZIF, architecture has eliminated the intermediate frequency, converting the received RF signals to near-dc frequencies. This means that closely spaced frequencies at RF will be closely spaced after they are converted via a homodyne receiver.
Because the radio has two stages of downconversion, it is generally more complex and more expensive due to the extra components such as discrete SAW filters and voltage-controlled oscillator (VCO)/synthesizers. 1(a) shows the superheterodyne receiver . 2 The Zero-IF Architecture In contrast, the homodyne, or zero-IF (ZIF), radio transceiver is a direct-conversion architecture, meaning that it utilizes one mixer stage to convert the desired signal directly to and from the baseband without any IF stages and without the need for external SAW filters.
7 Testing Modern Standards Even though there are different approaches to production testing, at this time most device testing is typically done with continuous-wave (CW) signals (instead of modulated signals). Such tests are basically the same for all different standards. The only differences in testing different standards are in the stimulus parameters such as power level, frequency, tone spacing, and so forth. The requirements of power levels, tone spacing, and so on are specified in the test plan document with inputs from the systems engineer to make sure that that specific device is following at least the IEEE standards.
Advanced Production Testing of RF, SoC, and SiP Devices by Joe Kelly